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02.03.2026

HIKMICRO SuperSCENE+: Detects Targets And Identifies Temperature Anomalies

SuperScene+ uses built-in algorithms to identify temperature measurement objects in specific scenarios and determine the presence of temperature anomalies. The built-in algorithm, which identifies objects using thermal imaging, does not support visual mode, as it is designed with performance and image efficiency in mind.

SuperScene+is applicable to the following models: M31, M60, SP40 (SP40H), SP60 (SP60H)

Application of SuperSCENE+ for Electrical Panel Maintenance and Diagnostics

What to pay attention to when servicing electrical panels

Fuse: Single-failure in parallel fuse arrays often goes undetected, triggering chain overload reactions (NA manufacturing statistics: 15% of electrical fires originate from fuse anomalies).

Terminal: Oxidation/loosening-induced contact resistance increases are stealth culprits of equipment downtime (EU Energy Association: 23% of industrial outages relate to terminal failures).

Limitations of Traditional Methods:

  • Low efficiency: Manual point-by-point thermal checks (30min/panel) require expertise; novices risk oversight.
  • Safety risks: Close proximity to live equipment (<0.5m) violates OSHA safe-distance protocols.
  • Data gaps: Paper-based records hinder traceability and digital system integration.

Pain Points and SuperSCENE+ benefits

  • Challenge: Technicians must rapidly screen large panels (50+ points) while identifying subtle threats (e.g., 5°C terminal temperature drift indicating imminent failure).
  • Solution: AI-powered risk stratification (high/medium/low) prioritizes red alerts, boosting efficiency by 60%.

SuperSCENE+ Functional Overview – Electrical Panel Inspection Mode

Electrical panel — Checking the fuses

AI dual-mode detection: Combines image recognition and ΔT algorithms to pinpoint overloaded/degraded fuses via absolute temperature alerts and relative differential warnings.

Optimized performance:

  • Trained on mainstream fuse models (98% recognition accuracy).
  • ±1°C precision achieved through anti-reflective coating compensation.

*Note: Optimal detection requires perpendicular alignment (±45° tilt tolerance).

Electrical Panel - Terminal Inspection

Micro-temperature sensing: Detects 0.5°C variations from poor contacts using resistance-heat modeling.

Application of SuperSCENE+ for PCB Inspection

Defect detection: Identifies >20 flaw types (opens, shorts, pinholes, residual copper) across multilayer boards. Traditional flying probe tests miss 30%+ micro-defects.

Efficiency bottlenecks:

  • Manual microscopy yields >20% error rates for sub-0.2mm features, risking ocular strain.
  • High-density PCB layer scans require >30min/board, disrupting production cycles.

Research Applications

  • Analyzes failure mechanisms (ionic migration/CAF, CTE mismatch) without destructive cross-sectioning (saves 2+ hours/sample).
  • Thermal mapping reveals hidden defects (e.g., cold solder joints) for material optimization.

Overview of SuperSCENE+ functionality in PCB inspection mode

PCB Inspection

Pre-configured templates + AI calibration enable batch screening of components (ICs, resistors/capacitors) to identify shorts, cold joints, and overloads

Advanced capabilities:

  • 10-zone templates per PCB (e.g., power modules, signal areas).
  • Differentiates normal/abnormal heating via copper-layer thermal conduction models.
  • Setup efficiency: Reduces new PCB calibration from 30+ minutes to ≤5 minutes through template reuse.

Advantages and benefits of Hikmicro SuperSCENE+ technology

  1. Automation: Auto-locates fuses/terminals in panels; PCB batch screening via predefined templates.
  2. Simplified Workflow: Panel inspection: Reduces to 2 steps (mode selection → scan) with instant results (color-coded alerts). PCB testing: Fixture-mounted one-click scans minimize human error.
  3. Reduces operational complexity for technicians while enhancing inspection safety and result reliability. Mitigates downtime risks and optimizes equipment lifecycle management efficiency.
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